MATERIA PCE/OCC

Poly Silicon Chunk Etching, Cleaning & Drying

SINGULUS TECHNOLOGIES developed a new machine concept with the product name MATERIA PCE/OCC for the cleaning of Si chunks, Si-Off-Cuts and ingot saw off cuts for the manufacturing of solar wafer. 

In the MATERIA, silicon is cleared of interfering particles, organic and metallic contaminations. With state-of-the-art technology, the fully automated and intelligent carrier management achieves a maximum throughput. With very good process results, the efficient process steps and the economical use of water and chemical substances as well as the low energy consumption reduce the cost of operation compared with the traditionally available machines.

Main Features

  • Surface cleaning & metal removal
  • Revolving barrel system
  • Smart DI rinse system
  • Clean, spot free & dry chunks
  • Excellent process results (metal values sufficiently lower than competitors)

 

 



OK

We use cookies to ensure the functionality and security of this website. In addition, third parties may set up individual documents and pages cookies. By using this site, you agree to the use of cookies. For more information on changing this setting, and the cookies used can be found at this link.