SILEX II - Features

Typical Features

  • High throughput performance up to 6000wph
  • High uptime up to 95%
  • Low breakage rate down to 0.01%
  • Wafer thickness down to 120╬╝m
  • Individual, flexible process sequencing
  • Onboard scheduler software for throughput tuning
  • Onboard performance analyzer software
  • Ozone-enhanced cleaning and etching processes
  • Short and stable IPA-free texturing process 
  • Appropriate and effective rinsing and drying


  • Process integration etching and cleaning (BKM SINGULUS)
  • Ozone injection equipment
  • Low surface process carrier

    • adapted to tool and application
    • metal-free
    • PP, PVDF, PEEK materials

  • Chemical supply systems
  • Waste water lifting stations
  • Chemical bath monitoring

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