The TIMARIS cluster tool is dedicated for the deposition of ultra-thin metallic and insulating films down to a thickness of one nanometer and below and stacks of such films with very precise material thickness and high uniformity specifications. However, this technology can also be used for applications with thicknesses in the micrometer. The high target utilization allows long lifetime before a target change.
As of today, more than ten process modules are available to configure a TIMARIS system according to customer needs. These modules include the Multi-Target-Module, Oxidation-Process-Module, Pre-Clean-Module, Combi-Process-Module, Four-Target-Module and Static-Deposition-Module as well as the Rotating-Substrate-Module. The Rotating-Substrate-Module is the core module of the ROTARIS platform, our sputtering system with a high flexibility including co-sputtering. The TIMARIS PVD modules incorporate the full scope of sputtering techniques as: DC magnetron sputtering, pulsed DC magnetron sputtering and RF magnetron sputtering as well as combinations of these modes are selectable by recipe.