Typical Performance Characteristics

  • Integrated power supply design
  • No carrier return system necessary
  • Fully vertical substrate transport
  • Special designed carrier transport system
  • Load and Unload of substrate from the same side of the machine
  • Usage of rotatable cylindrical magnetrons for highest utilization of target material
  • Temperature processing before and during deposition available
  • Gas separation by dynamic slit valves and/or by individual lock chambers
  • Smallest machine footprint thru turn chamber technology
  • Easy maintenance, low CoO
  • Fast target exchange, use any vendor target
  • Easy expansion possible
  • Vacuum base pressure: < 1 x 10-6 mbar
  • Typical process pressure: 2 - 5 x10-3 mbar

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