GERULUS
Wafer Block Pre-Clean & Deglue System
Virtually all silicon based wafers are cut by wire saw technology. The SINGULUS Pre-clean & Deglue system processes the wafers after being cut. This includes removal of slurry as well as degluing the wafers from their carrier beam. The GERULUS system can be configured in a wide range to adapt all kinds of slurry and glue types. To guarantee lowest possible water and surfactant consumption, the system can be equipped with a water & SiC recycling system. Main Features
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