Machine Versions

ROTARIS Basic

ROTARIS Basic sputtering system for processing up to 200 mm wafer.

Example of configuration:

  • 1x Rotating-Substrate-Module RSM
  • 1x Manual wafer load lock

ROTARIS Advanced

ROTARIS Advanced sputtering system with additional modules for processing up to 200 mm wafer.

Example of configuration:

  • 1 x Rotating-Substrate-Module RSM
  • 1 x Combi-Process-Module CMP
  • 1 x MX400 Central-Transport-Module CTM

ROTARIS Diversity

ROTARIS Diversity sputtering system with six modules for advanced processing up to 200 mm wafer.

Example of configuration:

  • 3 x Rotating-Substrate-Module RSM
  • 1 x Combi-Process-Module CMP
  • 1 x Small-Thermal-Process-Module sTPM
  • 1 x MX700 Central-Transport-Module CTM
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