TIMARIS II for 300 mm MRAM Wafer Production with Full Throughput

The footprint shown consists of:

  • 2 Multi-Target-Modules
  • Combi-Process-Module (CPM)
  • 1 Transport Module (Brooks)
    including EFEM and two FOUP
    Loadports
  • Multiple wafer handling
  • Throughput: up to 20 Wafer
    with standard MRAM layer stack
  • Software integration:
    GEM/SECSII Interface

TIMARIS II including one RSM System for R&D Purposes and/or low Volume Production for 200 mm or 300 mm Wafers

The footprint shown is for a tool for TMR (GMR) sensor fabrication and consists of:

  • 1 Multi-Target-Module
  • 1 Combination Process Module
  • 1 Rotating Substrate Module
  • 1 Transport Module (Brooks)
    including EFEM and two FOUP
    Loadports
  • Multiple wafer handling
OK

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