TIMARIS III High Throughput Deposition for Mass Production of MRAM and other Semiconductor Applications

The footprint shown consists of:

  • 2 x Multi-Target-Module (MTM) with 10 Targets each
  • 2 x Four-Target-Module (FTM) with 4 Targets each
  • 2 x Pre-Clean-Module (PCM)
  • UHV Transport Module 3 x M2c4 EFEM/FOUP
OK

We use cookies to ensure the functionality and security of this website. In addition, third parties may set up individual documents and pages cookies. By using this site, you agree to the use of cookies. For more information on changing this setting, and the cookies used can be found at this link.