TIMARIS III High Throughput Deposition for Mass Production of MRAM and other Semiconductor Applications

The footprint shown consists of:

  • 2 x Multi-Target-Module (MTM) with 10 Targets each
  • 2 x Four-Target-Module (FTM) with 4 Targets each
  • 2 x Pre-Clean-Module (PCM)
  • UHV Transport Module 3 x M2c4 EFEM/FOUP

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