Modular, Automated Wet Processing System for Batch Cleaning and Etching for Solar Cells

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SINGULUS TECHNOLOGIES provides complete automated dry-in/dry-out solutions for wet-chemical treatments of Si-wafers in standard and high-efficiency cell lines.

The modular SILEX II batch system offers a wide range of process options. With respect to highest flexibility in configuration, the SILEX II machine is characterized by a clear modular design and a compact footprint.

The SILEX II machine concept fulfills current and future requirements of capacity, flexibility and reliability for mass production.

The SILEX II 8000 system achieves an output of up to 8000 wph. The SILEX II 4000 system with a reduced batch size will cover a tool capacity of up to 4000 wph for smaller volume production. Both SILEX II systems are running with very low scrap rates down to 0.01 % and a high process yield.

SILEX II Batch Wet Processing Equipment

The SILEX II ALTEX machine is designed to apply IPA-free texturing processes, offering substantial cost advantages compared to traditional etching systems. This texturing process can be adjusted to the individual requirements of standard and advanced cell technologies.

The SILEX II CLEANTEX combines common etching and cleaning steps of monocrystalline Si with advanced cleaning and conditioning processes. Efficient cleaning steps are an indispensable requirement to improve cell efficiencies and reduce operation costs. Ozonebased cleaning operations, applied on SILEX II wet bench, combine efficient organic and metal removal with an appropriate surface conditioning. Due to low chemical costs and consumption, simple process control and high metal removal efficiency, ozonized cleaning baths are the perfect substitute for traditional, expensive multi-step RCA cleanings, known from the solar and semiconductor industry.

The SILEX II CLEAN is provided to run dedicated cleaning sequences for pre- or post-deposition processes. Depending on cell process flow and requirement the configuration can be designed individually, involving RCA or Ozone based cleanings as well as slight etching steps.

Typical Features

  • High throughput performance up to 8000 wph
  • High uptime up to 95 %
  • Low breakage rate down to 0.01 %
  • Wafer thickness down to 120 μm (‹120 µm on request)
  • Individual, flexible process sequencing
  • Onboard scheduler software for throughput tuning
  • Onboard performance analyzer software
  • Ozone-enhanced cleaning and etching processes
  • Short and stable IPA-free texturing process
  • Appropriate and effective rinsing and drying

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