The TIMARIS cluster tool is dedicated for the deposition (PVD sputtering/PECVD) of ultra-thin metallic and insulating films down to a thickness of one nanometer and below and stacks of such films with very precise material thickness and high uniformity specifications.
SINGULUS has already established and qualified the second generation of the TIMARIS PVD Cluster Tool platform in the market and is offering a complete portfolio of process modules for different applications.
As of today, more than ten process modules are available to configure a TIMARIS system according to customer needs. These modules include the Multi-Target-Module (MTM), Oxidation-Process-Module (OPM), Pre-Clean-Module (PCM), Combi-Process-Module (CPM), Four-Target-Module (FTM) and Static- Deposition-Module (SDM) as well as the Rotating- Substrate-Module (RSM).
The TIMARIS PVD modules (FTM , iPVD, MTM, RSM and SDM) incorporate the full scope of sputtering techniques as: DC magnetron sputtering, pulsed DC magnetron sputtering and RF magnetron sputtering as well as combinations of these modes are selectable by recipe.
- TMR, pTMR – MRAM
- Magnetic sensor (GMR, AMR, TMR)
- Integrated inductors
- Integrated voltage regulator (Buck Converter)
- High moment materials
- TFH reader & writer
All TIMARIS applications require the deposition of ultra-thin metallic and insulating films and film stacks down to a thickness of one nanometer and below with very precise material thickness and high uniformity specifications.
The MTM and the FTM are the key components of the TIMARIS platform; the MTM incorporates the Linear Dynamic Deposition (LDD, US patent US 7,799,179 B2) technology in combination with ten sputter targets in one vacuum chamber.