System

The machine utilizes advanced full-vacuum technology, achieving a final process chamber pressure of less than 10 mbar after a pump-down time of approximately 40 seconds. This significantly exceeds the vacuum levels typically required for high-quality PCB via filling processes.

Evacuating the complete process chamber provides several important advantages. Since the vacuum system and the filling head are fully decoupled, both components can be controlled independently. This enables multiple plugging cycles on the same printed circuit board without breaking the vacuum, making the process ideal for challenging PCB layouts, complex via geometries.

In addition, the full-vacuum chamber enables vacuum cleaning both before and after the via filling process. These cleaning steps remove trapped air and contaminants, improve paste application, and ensure highly reliable filling results across the entire PCB.

The vertical orientation of the printed circuit board allows double-sided via filling in a single process step, increasing throughput while maintaining exceptional filling quality. The VCPM+ combines precision, productivity, and process stability, making it an ideal solution for high-volume printed circuit board manufacturing and advanced PCB production.