High-Precision Via Filling in Printed Circuit Boards (PCBs) Using Either Conductive or Non-Conductive Paste
VHF Series – Features:
- Via hole filling of through holes and blind vias
- Less waste from the very valuable conductive paste
- Using high paste pressure to fill aspect ratio (1:40) boards
- Heatable headunit
VHF Series
The VHF is designed for high-precision Via Filling in printed circuit boards (PCBs) using either conductive or non-conductive paste. The system efficiently fills a wide range of via types, including through holes and blind vias, ensuring consistent quality and excellent process stability. It delivers optimal paste distribution and meets the demanding requirements of modern PCB manufacturing processes.
Different VHF machine configurations are available to suit various production needs. The system supports Via Filling with a movable filling head positioned above the printed circuit board, as well as selective filling using screen printing technology. This flexibility allows adaptation to different PCB designs and manufacturing strategies.
The VHF product family ranges from simple manual pilot systems without vacuum support to fully automated solutions for high-volume printed circuit board manufacturing. This makes the system suitable for both development environments and industrial PCB production, ensuring reliable Via Filling across different levels of process automation.
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Phone: +49 6188 440-1292
Email: sales@singulus.de