ALD is a specialized PVD technique that allows for extremely precise control over film thickness and composition. It works by alternately exposing the substrate to pairs of precursor gases that react to form a thin film one atomic layer at a time. ALD is used in the semiconductor industry and for applications requiring precise atomic-scale deposition.
Reduction of reflection on glass surfaces. Through anti-reflective coating distracting reflections are removed.
Inline coating (sputtering) machine
Bonding of disc halves.
While not technically a PVD method, CVD is often mentioned alongside PVD techniques. In CVD, chemical reactions occur in the gas phase to produce a solid film on a substrate. Unlike PVD, which involves physical processes, CVD relies on chemical reactions to deposit the material. It is used for depositing a wide range of materials, including semiconductors, ceramics, and various thin-film coatings.
Performed to prepare substrates for additional processing / coating.
Brilliant layers on plastic parts.
Electron beam coating” or “e-beam coating,” is a vacuum coating technique that utilizes electron beams to deposit thin films of material onto a substrate. This method is a type of Physical Vapor Deposition (PVD) and is commonly used in various industries for applications that require precise and controlled deposition of thin films with specific properties.
In evaporation based PVD, a solid source material is heated to a high temperature within a vacuum chamber. This causes the source material to vaporize and form a vapor plume. The vaporized material then condenses onto a substrate to create a thin film. This technique is often used for depositing metals and other materials with low melting points.
Inline sputtering system with horizontal substrate transport for e.g., solar cell, small glasses
Inline sputtering system with horizontal substrate transport for e.g., glass, CIGS, CdTe solar
Hydrophobic (water repellent) coating to prevent the adhesion of dust and other contaminants on the lens surface. The Hydrophobic Coat layer reduces the frequency of eyeglass lens cleaning during daily use.
Process by which the surface of an object is coated by immersion into a liquid.
Process by which the hard coat layer is applied during an immersion or spin coating process.
: This is a variation of sputtering that uses magnetic fields to enhance the efficiency and control of the sputtering process. Magnetron sputtering is commonly used for depositing thin films in electronics, optics, and architectural glass coatings.
Application (Sputtering)of a thin layer of metal (e.g., aluminum, gold, silver, silicon).
Metallizing refers to the process of applying a thin layer of metal onto a substrate or surface. This process is used in various industries and applications for a wide range of purposes, including enhancing the appearance of objects, providing corrosion resistance, improving electrical conductivity, and more.
Work area which comprises the application areas of the TIMARIS machine.
Unit of length, 0.000001 mm.
Plasma Enhanced Chemical Vapor Deposition – process used to apply Hard Coat and Topcoat to eyeglass lenses. Plasma is used in this process to deconstruct complex gas molecules. The product of this reaction precipitates onto the surface of a substrate forming a thin, hard layer.
Process during which the composition of a material is alternately converted between an amorphous and crystalline state.
Inline Sputtering system for 3d parts
PVD stands for Physical Vapor Deposition, which is a family of thin-film deposition techniques used in materials science and various industries. PVD methods are employed to deposit thin films of materials onto surfaces in a controlled and precise manner. These thin films can have a wide range of properties and applications, including improving the surface characteristics of materials or adding specific functionalities to them.
: Reactive sputtering is a specialized thin-film deposition technique used in materials science and various industries to create compound thin films with specific properties. It is a variation of the conventional sputtering process, but it involves introducing a reactive gas into the sputtering chamber along with the inert gas (typically argon). The reactive gas chemically reacts with the sputtered target material, resulting in the formation of compound thin films.
Inline evaporation system for large glass substrates
Fully automated replication line for discs
Patented sputter cathode for coating CD and DVD discs with highly uniform reflective layers. Also specially employed for the OPTICUS.
Active layer on Solar Cells.
Fully automated replication line for DVD
A coating process in which liquids such as dyes or lacquers are spun onto the surface of an object.
The process by which a thin layer of metal or silicon is deposited onto a Sputtering is a physical process used in materials science and microfabrication to deposit thin films of material onto a substrate. It involves the removal of atoms or molecules from a solid target material through the bombardment of the target with high-energy particles. This process is widely employed in various industries, including semiconductor manufacturing, thin-film coating, and surface modification.
In the context of sputtering, a “sputtering cathode” refers to the target material used in the sputtering process. The cathode is the electrode in a sputtering system that is subjected to bombardment by high-energy ions, typically generated from a plasma or ionized gas. When these ions strike the cathode (target material), they dislodge or sputter atoms or molecules from the cathode’s surface, which are then deposited as a thin film on a substrate.
The substrate is the surface onto which the thin film is to be deposited. It can be made of various materials, depending on the application, and is often a semiconductor wafer, glass, or another solid material.
Fully automated replication line for recordable discs
The target material to be deposited as a thin film is called the “target.” This target material is typically made of the substance you want to coat the substrate with, such as metals (e.g., aluminum, titanium), semiconductors (e.g., silicon), or dielectrics (e.g., oxides).
The thickness of the deposited film can be controlled by adjusting the sputtering time or the power applied to the sputtering process. This allows for precise control of the film’s thickness.
The ejected atoms then condense and deposit on the substrate’s surface, creating a thin film that has the same composition as the target material. The substrate’s temperature can be controlled to optimize the film’s adhesion and properties.
Vacuum sputtering system which operates in accordance with TMR principles, designed for use in the semiconductor industry. Manufactures either MRAM wafers or future read-write heads for magnetic hard disc drives.
Consistency in the thickness of a layer applied to the surface of an object.
Drying or curing of adhesives or lacquers through exposure to ultraviolet light.
Inline sputtering system with vertical substrate transport for e.g., glass, CIGS, CdTe solar
The sputtering process takes place in a vacuum chamber to eliminate the presence of air and other contaminants. Maintaining a vacuum ensures that the sputtered atoms can travel without interference and adhere to the substrate.
Vacuum coating, also known as thin-film deposition or vacuum deposition, is a process used to apply a thin layer of material onto a substrate’s surface in a vacuum or low-pressure environment. This technique is widely used in various industries for a range of purposes, including improving the properties of surfaces, enhancing the appearance of products, and adding functionality to materials. Vacuum coating methods are employed to create thin films with specific characteristics, such as optical properties, electrical conductivity, and corrosion resistance.
Vacuum coating technology, e.g., for anti-reflective coating on ophthalmic lenses, where material is melted and evaporated in a vacuum.