TIMARIS System Platform

PVD Production Platform for Semiconductor & Magnetic Films

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TIMARIS

e.g. for MRAM Production

→  1 Multi-Target-Modules
→  10 targets
→  1 Four-Target-Modules
→  1 Combi-Process-Module
→  1 Thermal-Process-Module
→  1 transport module including EFEM and 2 FOUP load ports
→  Multiple wafer handling
→  Throughput: up to 11 wafer per hour with standard MRAM layer stack
→  Software integration: GEM/SECSII interface

TIMARIS

e.g. for Inductor

  • →  1 Four-Target-Modules
  • →  1 Single-Target-Module
  • →  1 Pre-Clean-Process-Module
  • →  1 Degas-Module
  • →  1 transport module including EFEM and 2 FOUP load ports
  • →  Multiple wafer handling
  • →  Software integration: GEM/SECSII interface

TIMARIS STM

e.g. for Interconnect

  • →  200 mm Wafer
  • →  1 Pre-Clean-Process-Module
  • →  4 Single Target Modules
  • →  DC/RF sputtering
  • →  for metals and dielectric layer
  • →  1 transport module with two load locks
  • →  Multiple wafer handling
  • →  Software integration: GEM/SECSII interface

TIMARIS RSM

e.g. for Magnetic Sensor 200 mm

  • →  2 Rotating-Substrate-Modules
  • →  12 targets per module
  • →  1 transport module with two load locks
  • →  Multiple wafer handling
  • →  Throughput: up to 20 wafer per hour with standard TMR layer stack
  • →  Software integration: GEM/SECSII interface

TIMARIS RSM

e.g. for R&D

  • →  1 Rotating- Substrate-Modules
  • →  12 targets
  • →  1 transport module with single wafer load lock

TIMARIS

e.g. for Magnetic Sensor 300 mm

  • →  2 Multi-Target-Modules
  • →  10 targets per module
  • →  Combi-Process-Module
  • →  1 transport module including EFEM and 2 FOUP load ports
  • →  Multiple wafer handling
  • →  Throughput: up to 20 wafer per hour with standard TMR layer stack
  • →  Software integration: GEM/SECSII interface

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