TIMARIS System Platform

PVD Production Platform for Semiconductor & Magnetic Films

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TIMARIS

e.g. for MRAM Production

→ 1 Multi-Target-Modules
→ 10 targets
→ 1 Four-Target-Modules
→ 1 Combi-Process-Module
→ 1 Thermal-Process-Module
→ 1 transport module including EFEM and 2 FOUP load ports
→ Multiple wafer handling
→ Throughput: up to 11 wafer per hour with standard MRAM layer stack
→ Software integration: GEM/SECSII interface

TIMARIS

e.g. for Inductor

→ 1 Four-Target-Modules
→ 1 Single-Target-Module
→ 1 Pre-Clean-Process-Module
→ 1 Degas-Module
→ 1 transport module including EFEM and 2 FOUP load ports
→ Multiple wafer handling
→ Software integration: GEM/SECSII interface

TIMARIS STM

e.g. for Interconnect

→ 200 mm Wafer
→ 1 Pre-Clean-Process-Module
→ 4 Single Target Modules
→ DC/RF sputtering
→ for metals and dielectric layer
→ 1 transport module with two load locks
→ Multiple wafer handling
→ Software integration: GEM/SECSII interface

TIMARIS RSM

e.g. for Magnetic Sensor 200 mm

→ 2 Rotating-Substrate-Modules
→ 12 targets per module
→ 1 transport module with two load locks
→ Multiple wafer handling
→ Throughput: up to 20 wafer per hour with standard TMR layer stack
→ Software integration: GEM/SECSII interface

TIMARIS RSM

e.g. for R&D

→ 1 Rotating- Substrate-Modules
→ 12 targets
→ 1 transport module with single wafer load lock

TIMARIS

e.g. for Magnetic Sensor 300 mm

→ 2 Multi-Target-Modules
→ 10 targets per module
→ Combi-Process-Module
→ 1 transport module including EFEM and 2 FOUP load ports
→ Multiple wafer handling
→ Throughput: up to 20 wafer per hour with standard TMR layer stack
→ Software integration: GEM/SECSII interface

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