Removal of Excess Plugging Paste from Printed Circuit Boards (PCBs) and Inner Layers after the Via Filling Process
SV 200WV Grinding Machine – Features:
- Uniform surface with fine structure
- High precision
- High efficiency
SV 200WV Grinding Machine
The SV 200WV grinding machine is designed to remove excess plugging paste from printed circuit boards (PCBs) and inner layers after the Via Filling process. This enables the creation of a perfectly flat and uniform copper surface, which is essential for subsequent steps in printed circuit board manufacturing.
The grinding disk is driven by a servo motor, while the X-Y movement is manually controlled. The SV series is available with 115 mm and 150 mm grinding heads, offering flexibility for different PCB sizes and process requirements.
During operation, the inner or outer layers of the printed circuit board are securely fixed onto an aluminum working plate using a vacuum system. High-precision linear guides combined with adjustable grinding pressure ensure excellent grinding performance while preventing damage such as over-grinding of the copper foil.
The grinding head can be lowered onto the PCB with an accuracy of 0.22 µm (0.0056 mil), ensuring highly controlled material removal. One full rotation (100 increments) corresponds to 22 µm (0.56 mil), allowing fine and repeatable depth adjustment.
Uniform Surface Quality with Fine Structure
The excellent grinding result is realized by the pressure-controlled rotation and the motion of the grinding head.
- Additional application areas of the SV 200WV
- Burring and grinding holes (rigid printed circuit boards)
- Grinding after panel plating
- Grinding after pattern plating
- Cleaning and grinding of press plates
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Phone: +49 6188 440-1292
Email: sales@singulus.de