The SILEX III was specially designed for larger production volumes. With this mass production system about 550 MW annual capacity are possible for Heterojunction cell manufacturing. The SILEX III system achieves an output starting from 6000 up to 14000 WPH (gross). All SILEX III systems are running with very low scrap rates down to 0.01 % and a  high process yield.

The SILEX III ALTEX machine is designed to apply IPA-free texturing processes, offering substantial cost advantages compared to traditional etching systems. This texturing process can be adjusted to the individual requirements of standard and advanced cell technologies.
The SILEX III CLEANTEX combines common etching and cleaning steps of monocrystalline Si with advanced cleaning and conditioning processes. Efficient cleaning steps are an indispensable requirement to improve cell efficiencies and reduce operation costs. Ozone-based cleaning operations, applied on SILEX III wet bench, combine efficient organic and metal removal with an appropriate surface conditioning. Due to low chemical costs and consumption, simple process control and high metal removal efficiency, ozonized cleaning baths are the perfect substitute for traditional, expensive multi-step RCA cleanings, known from the solar and semiconductor industry.
The SILEX III CLEAN is provided to run dedicated cleaning sequences for pre- or post-deposition processes. Depending on cell process flow and requirement the configuration can be designed individually, involving RCA or Ozone based cleanings as well as slight etching steps.